Tekscend Photomask and IMS Nanofabrication Unveil Europe’s First Multibeam Mask Writer at AMTC Dresden
IMS Nanofabrication MBMW-100 Flex
Dresden, Germany — November 12, 2024 — Tekscend Photomask Germany GmbH, previously known as Toppan Photomasks, in cooperation with The Advanced Mask Technology Center (AMTC) has taken delivery and installed Europe’s first-ever Multibeam Mask Writer, the revolutionary MBMW-100 Flex from IMS Nanofabrication. This state-of-the-art tool is designed to meet the demands of advanced semiconductor manufacturing, from advanced optical applications to cutting-edge EUV lithography.
The MBMW-100 Flex, a worldwide first, drastically reduces mask writing time for complex semiconductor designs from multiple days to just 7-12 hours. This innovation ensures that Tekscend Photomask globally and its European operations remain competitive in the worldwide semiconductor market by making advanced mask production both industrially viable and cost-effective.
The installation of this pioneering technology is also a critical step in Europe’s pursuit of enhanced semiconductor capability. Local high-end photomask production is essential for ensuring a robust and innovative European semiconductor industry. The collaboration between IMS Nanofabrication, Tekscend Photomask and AMTC - all global leaders in their field - exemplifies the critical role that photomask technology plays in the global semiconductor ecosystem.
The President of Tekscend Photomask Europe, Adrian Phillips, said:
“The installation of Europe’s first Multibeam Mask Writer at our Dresden facility is a game-changer for the continent’s semiconductor resilience. It ensures Europe remains a global leader in advanced chip technology. This milestone reinforces Tekscend Photomask’s and the AMTC’s commitment to securing a bright and innovative future for European semiconductor manufacturing.”
Meanwhile the Chief Operating Officer of IMS Nanofabrication, Christof Klein, said:
“IMS is proud to partner with Tekscend Photomask and AMTC in deploying the first MBMW-100 FLEX in Dresden. We are confident our Multibeam Mask Writer will unlock both technical and economic benefits for advanced lithography applications. We look forward to continued collaboration with Tekscend and AMTC on driving semiconductor technology innovation in Europe.”
About IMS Nanofabrication
IMS Nanofabrication GmbH, based in Austria, is the global technology leader for multi-beam mask writers. Its customers are the largest chip manufacturers in the world, who rely on its technology to produce current and future chip generations. Over the last two decades, IMS has continuously refined and perfected its electron-based multi-beam technology in line with the latest market demands. The first-generation multi-beam mask writer, MBMW-101, entered the market in 2016 and is successfully operating all over the world. In 2023, IMS launched the MBMW-301, a fourth-generation multi-beam mask writer, that delivers unprecedented performance for the 2nm technology nodes. With its current product line, IMS covers a wide range of process technologies from mature nodes of 32nm to leading-edge technology of 2nm, providing a multi-beam mask writer for every use case.
Please see: www.ims.co.at/en/
About Tekscend Photomask
Tekscend Photomask Corp., is the world’s premier provider of photomasks for semiconductors and a group company of TOPPAN Holdings Inc. (TYO: 7911). Tekscend Photomask was previously known as Toppan Photomasks. Headquartered in Tokyo, Tekscend leverages its worldwide customer service network and eight manufacturing facilities in key geographic locations to offer the world's most advanced lithography technology. Tekscend is also expanding into nanoimprint molds and other nano-fabricated products. For more information, visit https://www.photomask.com/en.
Company Contact:
Les Dahl, Director Marketing
Tekscend Photomask Corp.
Phone: +1 512-334-7220
Email: Les.Dahl@photomask.com
